Interconnection Technology based on combination of Isotropic Conductive Adhesive filled by Metal-Coated Polymer Spheres with Compliant Ball Greed Array
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Interconnection technology based on combination of isotropic conductive adhesives (I CA) filled by metal – coated polymer spheres (MPS) with Compliant- Ball Grid Array (C- BGA) has been introduced and discussed as an alternative to technology featuring a combination of ICA with brittle solder BGA. As an MPS for ICA and C-BGA two types of MPS equal in production technology but different in size were used. The first type is an MPS for ICA with a diameter of 10 µm and 30 µm and for a second type MPS for C- BGA - 380 µm and 720 µm diameter. From this there are four combinations of different size MPS which will be examined. Since both types of MPS have the polymer core there would not be any mismatch of the thermal expansion coefficient and thereby it can potentially improve the mechanical properties. Moreover, different metal coatings of MPS and different sizes of MPS in combinations may affect electrical properties and reliability of the interconnection. Four types of samples, one for each of four types of combinations of MPS, were manufactured. They were electrically and mechanically tested; several effects were detected and characterized. However, the alternative idea of replacement of brittle solder by C- BGA in combination with ICA filled by MPS for interconnections requires a further in – depth study in order to be implemented.